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A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly

Electrical EngineeringIc AssemblyEngineeringAdvanced Packaging (Semiconductors)Fine-pitch Copper WireWafer Scale ProcessingChip On BoardComputer EngineeringChip AttachmentHybrid Intelligent ApproachElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)