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Dissociative Diffusion of Nickel in Silicon and Self-Diffusion of Silicon
103
Citations
12
References
1967
Year
Materials ScienceSemiconductorsEngineeringDiffusion ResistancePhysicsCrystalline DefectsSurface ScienceApplied PhysicsCondensed Matter PhysicsActive Nickel AtomsDiffusion ProcessIntrinsic ImpurityEnergy LevelDefect FormationSemiconductor MaterialActive NickelSilicon On InsulatorDissociative Diffusion
Behavior of electrically active nickel which acts as an acceptor in silicon is studied. Energy level of 0.41±0.01 eV below the conduction band at about 330°K, which includes the effect of the statistical weight factor, solubility of N S °=10 26 exp [-(3.1±0.2)/ k T ] cm -3 and reciprocal product of time constant of annealing of supersaturated state by dislocation density of 1/τ n d =1.3×10 -2 exp [-(1.4±0.2)/ k T ] cm 2 sec -1 have been obtained by Hall coefficient and resistivity measurements. It is concluded that the electrically active nickel atoms occupy the substitutional sites and nickel diffuses dissociatively and that the self-diffusion constant of silicon is 30exp [-(4.5±0.4)/ k T ] cm 2 sec -1 .
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