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Young’s modulus measurements and grain boundary sliding in free-standing thin metal films
101
Citations
11
References
2001
Year
Materials ScienceMaterials EngineeringMaterial AnalysisSmall Grain SizeEngineeringCrystalline DefectsSurface ScienceApplied PhysicsSolid MechanicsMicrostructure-strength RelationshipGrain Boundary SlidingThin Film Process TechnologyThin FilmsW FilmsDynamic Bulge-testing TechniqueThin Film ProcessingMicrostructure
Young’s modulus of free-standing polycrystalline Al, Au, and W films with submicron thickness has been studied using a dynamic bulge-testing technique. For Au and Al films a clear frequency dependence of the modulus is observed at room temperature in the range 1×10−4–0.5 rad/s. The values of the moduli are considerably smaller than the corresponding values of bulk material. The modulus of W films measured under the same conditions does not depend on frequency and is equal to the bulk value. The origin of the behavior found in the Al and Au films is anelastic grain boundary sliding. As a consequence of the relatively small grain size of thin polycrystalline films this phenomenon is observable at room temperature in films with a relatively low melting point.
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