Journal of Applied Polymer Science · 2013 · 21 citations · 27 references
Natural SciencesChemistryMaterials ScienceOrganic ChemistryPolymer ChemistryPolymer MaterialsPolymer CharacterizationThermosetsDielectric ConstantDielectric Constant MeasurementEpoxy ResinsGlass TransitionGlass Transition TemperatureGlass Transition Temperature DeterminationThermal DecompositionThermal Decomposition Reactions
ABSTRACT The fluorinated epoxy resin, 2,2‐bisphenol hexafluoropropane diglycidyl ether (DGEBHF) was synthesized through a two‐step procedure, and the chemical structure was confirmed by 1 H n uclear magnetic resonance (NMR), 13 C NMR, and Fourier transform infrared (FTIR) spectra. Moreover, DGEBHF was thermally cured with methyl hexahydrophthalic anhydride (MHHPA). The results clearly indicated that the cured DGEBHF/MHHPA exhibited higher glass transition temperature ( T g 147°C) and thermal decomposition temperature at 5% weight loss ( T 5 372°C) than those ( T g 131.2°C; T 5 362°C) of diglycidyl ether of bisphenol A (DGEBA)/MHHPA. In addition, the incorporation of bis‐trifluoromethyl groups led to enhanced dielectric properties with lower dielectric constant ( D k 2.93) of DGEBHF/MHHPA compared with cured DGEBA resins ( D k 3.25). The cured fluorinated epoxy resin also gave lower water absorption measured in two methods relative to its nonfluorinated counterparts. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2801–2808, 2013
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Hongzhi Liu, Sixun Zheng, Kangming Nie · Macromolecules · 2005 · 237 citations
Natural Sciences, Materials Engineering, Materials Science +17