Publication | Closed Access
A simulation and experimental study on packing of nanoinks to attain better conductivity
19
Citations
12
References
2010
Year
Colloidal MaterialEngineeringBulk ConductivityFinal ConductivityThermal ConductivityChemical EngineeringNanoelectronicsPrinted ElectronicsNanoscale ModelingElectronic PackagingNanomechanicsBetter ConductivityMaterials ScienceElectrical EngineeringNanoscale SystemNanotechnologyColloidal PropertyColloidal SystemOne-dimensional MaterialNanomaterialsApplied PhysicsExperimental StudyElectrical InsulationPacked Structure
A simulation and experimental study on the packing of nanoinks has been carried out. Simulation predicted that the packing of two different sized monodispersed colloids would results in a more densely packed structure than a single sized monodispered colloid alone. The simulated results were confirmed by conducting experiments with two different sized-monodispersed silver colloids. A binary sized ink was printed in a rectangular pattern using a direct write method system and then the final pattern was sintered. The pattern was confirmed to be highly conductive and the final conductivity obtained from this pattern gave 47% of the bulk conductivity of silver.
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