Publication | Closed Access
A modified creep model of epoxy adhesive at ambient temperature
123
Citations
6
References
2008
Year
Materials ScienceEngineeringEpoxy AdhesiveMechanical BehaviorAdhesive MaterialMechanical EngineeringThermoplastic CompositeThermomechanical AnalysisMechanics Of MaterialsStructural Adhesive
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