Copper electrodeposition from sulfate electrolytes in the presence of hydroxyethylated 2-butyne-1, 4-diol

Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system

Einar Mattsson, J. O’M. Bockris · Transactions of the Faraday Society · 1959 · 488 citations

Natural Sciences, Chemistry, Materials Science +14

Some fundamental aspects of levelling and brightening in metal electrodeposition

L. Oniciu, Liana Maria Mureşan · Journal of Applied Electrochemistry · 1991 · 312 citations

Natural Sciences, Materials Engineering, Materials Science +14

Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

Lucien Bonou, Marielle Eyraud, Renaud Denoyel et al. · Electrochimica Acta · 2002 · 182 citations

Natural Sciences, Chemistry, Materials Science +16

The Effect of Some Addition Agents on the Kinetics of Copper Electrodeposition from a Sulfate Solution

Dennis R. Turner, Glenn R. Johnson · Journal of The Electrochemical Society · 1962 · 146 citations

Natural Sciences, Chemistry, Materials Science +17

Effect of thiourea, benzotriazole and 4,5-dithiaoctane-1,8-disulphonic acid on the kinetics of copper deposition from dilute acid sulphate solutions

E. E. Farndon, Frank C. Walsh, S.A. Campbell · Journal of Applied Electrochemistry · 1995 · 133 citations

Natural Sciences, Chemical Engineering, Chemistry +6