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Thermally-aware modeling and performance evaluation for single-walled carbon nanotube-based interconnects for future high performance integrated circuits

Future High PerformanceElectrical Engineering3D Ic ArchitectureEngineeringVlsi DesignAdvanced Packaging (Semiconductors)NanoelectronicsComputer EngineeringThermal ModelingIntegrated CircuitsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringThermally-aware ModelingInterconnect (Integrated Circuits)