Publication | Closed Access
Evaluation of properties of Ta–Ni amorphous thin film for copper metallization in integrated circuits
10
Citations
9
References
2007
Year
Materials ScienceEngineeringApplied PhysicsThin Film DevicesIntegrated CircuitsThin FilmsAmorphous SolidThin Film Process TechnologyThin Film ProcessingAmorphous MetalCopper Metallization
| Year | Citations | |
|---|---|---|
Page 1
Page 1