Simultaneous Preparation of PI/POSS Semi‐IPN Nanocomposites

Abstract

Abstract Summary: This investigation presents a simultaneous and convenient approach to produce a high‐performance polyimide with a low dielectric constant by introducing the octa‐acrylated polyhedral oligomeric silsesquioxane (methacrylated‐POSS) into a polyimide matrix to form polyimide semi‐interpenetrating polymer network (semi‐IPN) nanocomposites. The differential scanning calorimetry (DSC) and Fourier‐transform infrared (FT‐IR) results indicate that the self‐curing of methacrylated‐POSS and the imidization of polyamic acid (PAA) occurs simultaneously. The morphology of a semi‐IPN structure of polyimide/POSS‐PI/POSS nanocomposites with POSS nanoparticles embedded inside the matrix is elucidated. The POSS particles are uniform and are aggregated to a size of approximately 50–60 nm inside the polyimide matrix. The interconnected POSS particles are observed at high POSS content. The structure is highly cross‐linked, so the PI/POSS nanocomposites have an enhanced glass transition temperature. The high porosity of the PI/POSS nanocomposites markedly reduces the dielectric constant of PI because of the nanometer‐scale porous structure of POSS. FT‐IR spectra of the various compounds of A) methacrylate‐POSS before curing, B) methacrylate‐POSS after curing, C) PAA containing 15 wt.‐% POSS, and D) PI/POSS containing 15 wt.‐% POSS. magnified image FT‐IR spectra of the various compounds of A) methacrylate‐POSS before curing, B) methacrylate‐POSS after curing, C) PAA containing 15 wt.‐% POSS, and D) PI/POSS containing 15 wt.‐% POSS.