Flexible and Transparent Silicon‐on‐Polymer Based Sub‐20 nm Non‐planar 3D FinFET for Brain‐Architecture Inspired Computation

Abstract

An industry standard 8'' silicon-on-insulator wafer based ultra-thin (1 μm), ultra-light-weight, fully flexible and remarkably transparent state-of-the-art non-planar three dimensional (3D) FinFET is shown. Introduced by Intel Corporation in 2011 as the most advanced transistor architecture, it reveals sub-20 nm features and the highest performance ever reported for a flexible transistor.