Wettability of molten Sn–Bi–Cu solder on Cu substrate - Concepedia

Concepedia

Publication | Open Access

Wettability of molten Sn–Bi–Cu solder on Cu substrate

DOI Full Paper Access

64

Citations

13

References

2009

Year

Likun Zang, Zhangfu Yuan, Hongxin Zhao, Xiaorui Zhang

Materials Letters

Materials EngineeringMaterials ScienceMolten Sn–bi–cu SolderEngineeringCorrosionSurface ScienceElectronic PackagingMetal Processing

References

	Year	Citations

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