Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM - Concepedia

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Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM

84

Citations

16

References

2010

Year

Chi-Ming Lai, R.H. Chen, C.H. Lin

Energy and Buildings

Materials ScienceHeat Transfer ProcessEngineeringMechanical EngineeringThermal ManagementThermodynamicsThermal Energy StorageElectronic PackagingHeat TransferThermal EngineeringGypsum BoardsThermal Storage Behaviour

References

	Year	Citations

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