Characterization of low speed shear test reliability of Sn–1.0Ag–XCe/ENEPIG solder joint - Concepedia

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Characterization of low speed shear test reliability of Sn–1.0Ag–XCe/ENEPIG solder joint

15

Citations

23

References

2013

Year

Q. V. Bui, Seung‐Boo Jung

Journal of Alloys and Compounds

Materials ScienceEngineeringMechanical EngineeringSn–1.0ag–xce/enepig Solder JointElectronic PackagingMechanics Of Materials

References

	Year	Citations

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