Kinetics of the Deposition of Alumina Particles from Copper Sulfate Plating Baths

Abstract

In 1972 Guglielmi proposed a physical model describing the codeposition mechanism of inert particles from electrolytic baths. The proposed mechanism was based on two successive adsorption steps. The present authors demonstrated the validity of that mechanism for the codeposition of alumina and copper from acidified copper sulfate plating baths. From an experimentally derived relationship between electrolytic conditions and codeposition, the importance of the reduction of copper ions adsorbed onto is shown. The influence of monovalent cations like thallium is discussed based on the mechanism proposed by Guglielmi.