Publication | Closed Access
Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials
93
Citations
7
References
2011
Year
Materials ScienceElectrical EngineeringEngineeringDiffusion ResistanceThermal TransportApplied PhysicsThermoelectric MaterialThermodynamicsThermal ConductionHeat TransferElectronic PackagingThermal EngineeringThermal ConductivityThermoelectric Materials
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