Publication | Closed Access
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn–3Cu/Cu single crystal joints
28
Citations
28
References
2009
Year
Materials ScienceEngineeringSevere Plastic DeformationMechanical PropertiesMechanical BehaviorInterfacial Fracture BehaviorsMechanical EngineeringSolder ThicknessCrack FormationStrain RateMechanics Of Materials
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