Publication | Closed Access
Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates
100
Citations
23
References
1998
Year
Materials EngineeringMaterials ScienceElectrical EngineeringEpitaxial GrowthEngineeringNanotechnologySurface ScienceApplied PhysicsSio2/si SubstratesThin FilmsSilicon On InsulatorMicroelectronicsChemical Vapor DepositionCopper Thin FilmsThin Film ProcessingAdhesion Energy
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