An XPS study of copper corrosion originated by formic acid vapour at 40% and 80% relative humidity

C. L. Torres, J. M. Bastidas

Materials and Corrosion · 2001 · 145 citations · 0 references

Concepts

Abstract

Copper corrosion products originated by the action of formic acid vapours at 40% and 80% relative humidity for a period of 21 days were analysed. Three formic vapour concentration levels (10, 100 and 300 ppm) were generated in laboratory tests at 30°C. The corrosion product layers were characterised using X-ray photoelectron spectroscopy (XPS) in conjunction with Ar+-ion sputtering. The components identified in the patina layers were cuprite (Cu2O), copper hydroxide (Cu(OH)2) and copper formate (Cu(HCOO)2). Copper formate was formed by a complex mechanism including copper hydroxide and formic acid.