High-resolution three-dimensional imaging of flat objects by synchrotron-radiation computed laminography

Abstract

Computed laminography with synchrotron radiation is developed and carried out for three-dimensional imaging of flat, laterally extended objects with high spatial resolution. Particular experimental conditions of a stationary synchrotron source have been taken into account by a scanning geometry different from that employed with movable conventional laboratory x-ray sources. Depending on the mechanical precision of the sample manipulation system, high spatial resolution down to the scale of 1μm can be attained nondestructively, even for objects of large lateral size. Furthermore, high beam intensity and the parallel-beam geometry enables easy use of monochromatic radiation for optimizing contrast and reducing imaging artifacts. Simulations and experiments on a test object demonstrate the feasibility of the method. Application to the inspection of solder joints in a flip-chip bonded device shows the potential for quality assurance of microsystem devices.