Publication | Closed Access
Package embedded heat exchanger for stacked multi-chip module
28
Citations
9
References
2004
Year
Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Energy EfficiencyComputer EngineeringChip AttachmentStacked Multi-chip ModuleHeat TransferElectronic PackagingMicroelectronicsThermal Engineering
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