Thermoelectric properties of Cu doped ZnSb containing Zn3P2 particles

Abstract

We prepared ZnSb containing Zn3P2 particles of size ranging from a few tens to several hundred nanometers by melting powders of Zn, Sb, and P. Materials with Zn3P2 content up to 3.75% were made and subsequently ball-milled and hot pressed. A reduction in the thermal conductivity of 15% was achieved. By adding 0.2% Cu the carrier concentration increased an order of magnitude, to 2.0 × 1019 cm−3, while the mobility remained unaffected. The resulting increase in electrical conductivity together with the reduced thermal conductivity, led to a significant increase in the dimensionless figure of merit, in excess of 0.9 around 550 K.