Mitigation of Sn Whisker Growth by Small Bi Additions

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

W. J. Boettinger, C. E. Johnson, L.A. Bendersky et al. · Acta Materialia · 2005 · 320 citations

Materials Science, Engineering, Surface Electrochemistry +6

Filamentary Growths On Metal Surfaces—“Whiskers”

Kenneth G. Compton, A. Mendizza, S. M. Arnold · CORROSION · 1951 · 199 citations

Spontaneous whisker growth on lead-free solder finishes

K. N. Tu, J.C.M. Li · Materials Science and Engineering A · 2005 · 187 citations

Materials Science, Engineering, Corrosion +4

Sn whisker growth during thermal cycling

Katsuaki Suganuma, Alongheng Baated, Keun‐Soo Kim et al. · Acta Materialia · 2011 · 101 citations

Engineering, Physics, Thermal Transport +6

Impact of the ROHS Directive on high-performance electronic systems

Karl J. Puttlitz, G.T. Galyon · Journal of Materials Science Materials in Electronics · 2006 · 90 citations

Hardware Security, Engineering, Vlsi Design +7