Publication | Closed Access
Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
77
Citations
17
References
2009
Year
Materials ScienceMaterials EngineeringEngineeringCrystal Growth TechnologyApplied PhysicsCu Pillar/sn BumpsMetallurgical InteractionMetallurgical ProcessTemperature EffectHot WorkingThermomechanical ProcessingMicrostructure
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