Structural and dielectric properties of some epiclon-based polyimide films

Abstract

Abstract Surface and electrical properties of two flexible and cross-linked epiclon based polyimide films were investigated. Surface tension measurements indicate an increased hydrophobicity due to both isothermal treatment - which induces imidization and cross-linking - and to the chemical structure, characterized by the different number of ether linkages in the polyimide backbone. Morphology of film surfaces, modified by plasma treatment, shows high roughness and, implicitly, improved adhesion, as required in electronics. The studied polyimides exhibit low dielectric constants and dielectric losses, comparatively to conventional aromatic polyimides. The electrical conductance and resistivity characteristics of these polymers recommend them as good insulators for dielectric layers in microelectronic applications.