Compressibility, Cohesive Energy, and Hardness of Non‐Metallic Solids

Abstract

Abstract A new formulation which relates compressibility with cohesive energy and molecular volume for dielectric solids, is given. The relation has been confirmed with forty‐five crystalline compounds (binaries and ternaries) representing nine different structures. An atomistic expression of compressibility is developed and its bearing on various methods of hardness testing is reviewed.