Publication | Closed Access
A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature
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Citations
34
References
2008
Year
Materials EngineeringMaterials ScienceRoom TemperatureEngineeringImpression-relaxation CreepMechanical EngineeringLead-free Sn–9znElectronic Packaging
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