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Stress evolution in magnetron sputtered Ti–Zr–N and Ti–Ta–N films studied by in situ wafer curvature: Role of energetic particles

Materials ScienceMaterial AnalysisEngineeringSitu Wafer CurvatureApplied PhysicsEnergetic ParticlesStress EvolutionThin Film Process TechnologyThin FilmsEpitaxial GrowthThin Film ProcessingMicrostructure