Publication | Closed Access
Growth of aluminum nitride on (111) silicon: Microstructure and interface structure
107
Citations
13
References
1998
Year
Aluminium NitrideEngineeringSevere Plastic DeformationSilicon On InsulatorLayer ThicknessAluminum NitrideHexagonal AluminumEpitaxial GrowthMaterials ScienceMaterials EngineeringCrystalline DefectsSemiconductor Device FabricationMicrostructureDislocation InteractionFilm ThicknessSurface ScienceApplied PhysicsThin FilmsInterface Structure
The growth of hexagonal aluminum nitride directly on (111) silicon has been studied by grazing incidence x-ray diffraction and high resolution electron microscopy as a function of film thickness. Two epitaxial relationships were observed: (1) AlN (0001) [211¯0]//Si(111) [022̄], which prevails at deposition temperatures larger than 650 °C, and (2) AlN (0001) [101̄0]//Si(111) [022̄]. For a 40 Å thick layer, the average in-plane crystallite size is 162 Å, the in-plane rotation is ∼2° and the dislocations induce an average strain distribution of 0.8%. The Si/AlN interface is very sharp and complete relaxation (down to ∼0.2%) occurs within one bilayer. No long range order was observed at the interface. This implies a low mobility of the AlN species on Si, inhibiting any structural rearrangement. In particular the in-plane rotations originate from the early stage of the layer growth and decrease with the layer thickness, especially for thicknesses larger than 250 Å.
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