Publication | Closed Access
Correlation of electromigration defects in small damascene Cu interconnects with their microstructure
10
Citations
4
References
2005
Year
Materials ScienceMaterials EngineeringElectrical EngineeringDefect ToleranceEngineeringElectromigration TechniqueNanoelectronicsApplied PhysicsDefect FormationElectromigration DefectsElectronic PackagingMicroelectronicsElectrochemical InterfaceSmall Damascene CuInterconnect (Integrated Circuits)Electrical Insulation
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