Concepedia
Materials Science and Engineering A · 2006 · 105 citations · 17 references
Natural SciencesDesignCell AdhesionMechanical Behavior Of MaterialsAdhesive BondingTensile PropertiesThin Film AdhesionAdhesion CoefficientAdhesion PropertiesAdhesion StrengthAdhesive PropertiesAdhesiveness
17
Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination
D. B. Marshall, A.G. Evans · Journal of Applied Physics · 1984 · 457 citations
Natural Sciences, Materials Engineering, Materials Science +17
Growth and configurational stability of circular, buckling-driven film delaminations
John W. Hutchinson, M.D. Thouless, E. Liniger · Acta Metallurgica et Materialia · 1992 · 324 citations
Natural Sciences, Materials Engineering, Materials Science +12
New developments in the modelling of the hardness and scratch adhesion of thin films
S.J. Bull, D.S. Rickerby · Surface and Coatings Technology · 1990 · 294 citations
Natural Sciences, Materials Engineering, Materials Science +16
The characterization of telephone cord buckling of compressed thin films on substrates
Minkyu Moon, Henrik Myhre Jensen, John W. Hutchinson et al. · Journal of the Mechanics and Physics of Solids · 2002 · 225 citations
Natural Sciences, Materials Engineering, Materials Science +14
Microscratch and load relaxation tests for ultra-thin films
Tong Wu · Journal of materials research/Pratt's guide to venture capital sources · 1991 · 198 citations