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A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate

Materials ScienceEngineeringMechanical BehaviorMechanical EngineeringPolymer ScienceHighly-crosslinked EpoxyMaterial ModelingMolding (Process)Microstructure-strength RelationshipPolymer ModelingPlasticitySoft MatterMolecular Dynamics StudyMechanics Of MaterialsTensile Strength