Concepedia

Abstract

Abstract A new process for encapsulation of electroactive areas of microelectrodes by electropolymerization is described. The major difference from conventional techniques is the ability to fabricate encapsulated microelectrodes inexpensively regardless of their dimensions and shape by the same procedure. The thickness of the coating is controlled by the deposition time. The voltammetric characteristics and the integrity of the insulation have been evaluated and the response time was also measured. — Procedure for preparation of bipolar ultramicroelectrodes has been developed. For that purpose the integral auxiliary electrode was prepared by deposition of a Pt‐layer on the poly(oxyphenylene) insulation. The electrochemical behavior of both electrodes which are separated by the insulation layer was tested separately.

References

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