Publication | Closed Access
Structure modification of radio frequency sputtered LaB6 thin films by internal stress
31
Citations
0
References
1991
Year
EngineeringRadio FrequencyVacuum DeviceThin Film Process TechnologyLab6 Thin FilmsLab6 FilmNanoelectronicsElectronic PackagingThin Film ProcessingMaterials EngineeringMaterials SciencePhysicsStructure ModificationMicroelectronicsMaterial AnalysisSurface ScienceApplied PhysicsThin FilmsChemical Vapor Deposition
Thin films of LaB6 are prepared by a radio frequency (rf) magnetron sputtering technique. The effect of sputtering conditions on the film properties of internal stress and crystalline orientation are investigated. The film deposited at low pressures (<1 Pa) has a strong compressive stress as high as 109 Pa. As the pressure of Ar discharge gas decreases, the internal stress becomes greater and the preferred orientation is transformed in the sequence: (100)→(110)→(111). This behavior can be explained as an energetically favorable structure of LaB6 film by taking both the surface energy and the strain energy into account. An application of a negative bias (−20 V) to substrates results in a greater stress, so that the (110) and (111) orientation becomes more preferential.