Publication | Closed Access
Stabilization of copper(III) complexes by disubstituted oxamides and related ligands
87
Citations
13
References
1997
Year
Inorganic ChemistryChemical EngineeringEngineeringMolecular ElectrochemistryRelated LigandsCoordination ComplexOrganometallic ElectrochemistryFormal PotentialsReduction PotentialsMolecular ComplexChemistryTrivalent CopperInorganic SynthesisElectrochemistryInorganic Compound
The electrochemical behaviour of a family of monomeric copper(II) complexes of the related tetraanionic chelating ligands N,N′-o-phenylenebis(oxamate) (L 1 ) and its methylamide (L 2 ) and bis(methylamide) (L 3 ) has been investigated by cyclic voltammetry in acetonitrile at 25 °C and 0.1 mol dm -3 NEt 4 ClO 4 as supporting electrolyte. The copper(III)–copper(II) reduction potentials have been found to span a potential range from +0.41 to -0.02 V (vs. saturated calomel electrode), being reversible for all cases except the copper(II)–L 1 complex. The trend in formal potentials along this series is explained in terms of the stronger donor properties of the deprotonated-amido nitrogen atoms than those of the carboxylate oxygen ones. Hence, the stabilization of the trivalent oxidation state of copper is attributed to the increasing number of deprotonated-amido donor groups. A perfect correlation has been observed within this family between the Cu III –Cu II potentials and the visible absorption maxima of the copper(II) complexes. The relative gain in crystal-field stabilization energy for the change from the d 9 (Cu II , square planar) to the low-spin d 8 (Cu III , square-planar) electronic configuration is the main factor in the overall thermodynamic stability of the copper(III) complexes. The molecular structure of the stable copper(III) complex [PPh 4 ][CuL 3 ]·MeCN has been determined by single-crystal X-ray analysis. The metal is in a nearly square-planar environment formed by the four amido nitrogen atoms of the chelating ligand, with short Cu–N bond distances (1.84–1.88 Å) typical of trivalent copper.
| Year | Citations | |
|---|---|---|
Page 1
Page 1