Applied rolling and sensitivity of Bi(2223)/Ag tapes on degradation by mechanical stress

Abstract

An experimental study of multicore Bi(2223)/Ag tapes, roll-sintered by different methods and subjected to bending and tension stresses has been performed. The tapes, of various technological histories, were bent and tensioned and subsequently the transport current was measured at each stressed state. Comparison of degradation curves shows that applied rolling may influence the sensitivity of Bi-2223 filaments against the mechanical stress. The existence of transverse microcracks caused by intermediate rolling leads to a higher sensitivity of the tape to bending. A lowering of critical current degradation was observed for two-axially rolled tapes having a higher filament density and better homogeneity prior to sintering treatment.