Publication | Closed Access
Investigations of the SiO2/Si interface. I. Oxidation of a clean Si(100) surface using photoemission spectroscopy with synchrotron radiation
44
Citations
27
References
1989
Year
Materials ScienceSemiconductorsChemical EngineeringSurface CharacterizationSio2 LayerEngineeringOxidation ResistanceSurface AnalysisSurface ScienceApplied PhysicsClean SiSemiconductor Device FabricationIntegrated CircuitsSio2/si InterfaceSio2 Layer ThicknessSynchrotron RadiationSilicon On Insulator
The surface oxidation process of Si(100), and the distribution of intermediary oxidation states at the SiO2/Si interface have been extensively studied by high resolution (ΔE<0.3 eV) photoemission spectroscopy using synchrotron radiation. The results show that the ratio at the SiO2/Si interface for three intermediary states, Si3+, Si2+, and Si1+ (SiOx), is strongly dependent on SiO2 layer thickness. In particular, the proportion of Si3+ increases with the formation of the 0∼1 nm thick SiO2 layer. However, the three intermediary components at the interface are distributed with ratios of Si3+:Si2+:Si1+=7:2.5:1 in the oxidation stage where a SiO2 layer is formed over 1 nm.
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