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Generalized formula for curvature radius and layer stresses caused by thermal strain in semiconductor multilayer structures
134
Citations
6
References
1983
Year
EngineeringMechanical EngineeringStressstrain AnalysisMicrostructure-strength RelationshipElectronic PackagingThermal StrainThermomechanical AnalysisMaterials ScienceMaterials EngineeringLayer StressesMechanical BehaviorSolid MechanicsSemiconductor MaterialCurvature RadiusApplied PhysicsMaterial ModelingThermal EngineeringMechanics Of MaterialsHigh Strain Rate
The generalized formulas have been derived for the curvature radius and layer stresses caused by thermal strain in semiconductor multilayer structure with different elastic moduli and growth temperatures. Several special forms and applications are given.
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