Improved High Efficiency Stacked Microstructured Neutron Detectors Backfilled With Nanoparticle $^{6}$LiF

Abstract

Silicon diodes with large aspect ratio trenched microstructures, backfilled with <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> LiF, show a dramatic increase in thermal neutron detection efficiency beyond that of conventional thin-film coated planar devices. Described in this work are advancements in the technology using detector stacking methods to increase thermal neutron detection efficiency, along with the current process to backfill <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sup> LiF into the silicon microstructures. The highest detection efficiency realized thus far is over 42% intrinsic thermal neutron detection efficiency by device-stacking methods. The detectors operate as conformally diffused pn junction diodes each having 1 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> area. Two individual devices were mounted back-to-back with counting electronics coupling the detectors together into a single dual-detector device. The solid-state silicon device was operated at 3 V and utilized simple signal amplification and counting electronic components that have been adjusted from previous work for slow charge integration time. The intrinsic detection efficiency for normal-incident 0.0253 eV neutrons was found by calibrating against a <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> He proportional counter.