Morphology, microstructure, and mechanical properties of a copper electrodeposit - Concepedia

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Morphology, microstructure, and mechanical properties of a copper electrodeposit

98

Citations

13

References

2004

Year

David T. Read, Yi‐Wen Cheng, Roy H. Geiss

Microelectronic Engineering

Materials ScienceEngineeringCopper ElectrodepositSurface ElectrochemistryElectrode Reaction MechanismElectrochemistry

References

	Year	Citations

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