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Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

Materials EngineeringMaterials ScienceNi–sn Intermetallic CompoundsEngineeringBinary Ag–snApplied PhysicsMetallurgical InteractionAlloy PhaseLead-free Solder AlloysAlloys