Underfill constraint effects during thermomechanical cycling of flip-chip solder joints - Concepedia

Concepedia

Publication | Closed Access

Underfill constraint effects during thermomechanical cycling of flip-chip solder joints

40

Citations

11

References

2002

Year

I. Dutta, A. Gopinath, C. Marshall

Journal of Electronic Materials

Materials ScienceFriction WeldingEngineeringMechanical BehaviorMechanicsMechanical EngineeringUnderfill Constraint EffectsChip AttachmentElectronic PackagingThermomechanical AnalysisThermal EngineeringThermomechanical ProcessingMechanics Of Materials

References

	Year	Citations

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