Solid-solution copper alloys with high strength and high electrical conductivity

Abstract

Solid-solution copper alloys are standard and widely used conductive materials. However, it is generally considered difficult to significantly improve the balance between the strength and electrical conductivity of these alloys. Here, we designed copper alloys that exhibit high strength and conductivity by using solid-solution hardening enhanced by supersaturation with Mg. Cu–Mg alloy has a conductivity at least three times higher than that of the representative solid-solution Cu–Sn, while retaining comparable strength. Cu–Al–Mg alloy showed greater strength and conductivity than Cu–Sn.