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Bulk and interface stresses in silver-nickel multilayered thin films
156
Citations
32
References
1993
Year
Materials ScienceSurface CharacterizationEngineeringSurface ScienceApplied PhysicsMaterials CharacterizationSubstrate CurvatureX-ray DiffractionMicrostructure-strength RelationshipThin Film Process TechnologyThin FilmsInterface StressesDepth-graded Multilayer CoatingMicrostructureThin Film Processing
Stresses were measured in 〈111〉-textured Ag/Ni multilayered thin films from the substrate curvature and from lattice parameter measurements by x-ray diffraction. The difference between the total multilayer film stress and the layer deposition stresses can be attributed to a tensile interface stress of −2.27±0.67 J/m2. Interfacial phase formation is unlikely in this system as indicated by the exceptionally low mutual solubilities.
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