Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1997 · 14 citations · 0 references
EngineeringMaterials EngineeringMaterials ScienceMaterials ProcessingSurface EngineeringSurface ScienceSurface Finish QualitySurface FinishesSurface FinishingSurface PreparationSurface RoughnessSurface TreatmentPolishingPolishing ProcessesRapid ManufacturingSubsurface Damage ReductionSurface Finish FormationSurface PolishingSurface Smoothness Evaluation
Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. Recent work has shown success on 350 mm square parts; current work involves scaling the process to 1.4 meter diameter. For the 350 mm square piece of BK7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing.