Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration - Concepedia

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Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

16

Citations

9

References

2006

Year

Liping Yang, D.H. Zhang, C.Y. Li, Ruhai Liu, Ping Lu, P.D. Foo, Andrew T. S. Wee

Thin Solid Films

Materials ScienceMaterials EngineeringElectrical EngineeringEngineeringNanoelectronicsInterconnect (Integrated Circuits)Applied PhysicsComparative InvestigationSemiconductor MaterialElectronic PackagingMicroelectronicsSicn Barrier Layer

References

	Year	Citations

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