Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes

Abstract

Acid copper plating on mild steel metallic foil is very difficult due to the galvanic displacement reaction of copper on mild steel. This can be avoided by using a suitable complexing agent. The present investigation deals with the electrodeposition of copper from non-cyanide electrolytes using glycerol as complexing agent in an alkaline medium in the presence of gelatin, anisaldehyde, imidazole and peptone as additives. These additives influence the morphology of the deposited copper films by reducing the grain size, ensuring smoothness and brightness of the films. The additives also improve the throwing power of the depositing electrolytes. The X-ray diffraction pattern obtained for the electrodeposited copper film shows a polycrystalline and face centred cubic structure. The crystal size of the copper film was calculated using Debye Scherrer's formula. A uniform and pin hole free surface morphology was observed under SEM, which revealed the grain refining brought about by the additives.