Publication | Closed Access
Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution
57
Citations
16
References
2008
Year
Materials ScienceEngineeringNanoporous MaterialElectrode-electrolyte InterfaceAqueous SolutionSurface ElectrochemistrySurface ScienceMesoporous SiliconChemistryElectrochemical ProcessElectrochemistry
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