Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution

Damascene copper electroplating for chip interconnections

P. C. Andricacos, Cyprian Uzoh, John Dukovic et al. · IBM Journal of Research and Development · 1998 · 1.2K citations

Engineering, Materials Engineering, Materials Science +16

Filling of TiO₂ Nanotubes by Self‐Doping and Electrodeposition

Jan M. Macák, Bin Gong, Michael Hueppe et al. · Advanced Materials · 2007 · 306 citations

Natural Sciences, Materials Engineering, Materials Science +17

Synthesis and Electrochemical Properties of Single-Crystal V₂O₅ Nanorod Arrays by Template-Based Electrodeposition

Katsunori Takahashi, Steven J. Limmer, Ying Wang et al. · The Journal of Physical Chemistry B · 2004 · 263 citations

Natural Sciences, Chemistry, Materials Science +17

Antimony Nanowire Arrays Fabricated by Pulsed Electrodeposition in Anodic Alumina Membranes

Yongkui Zhang, Guozhu Li, Yucheng Wu et al. · Advanced Materials · 2002 · 147 citations

Natural Sciences, Materials Engineering, Materials Science +16

Electrodeposition of metals into porous silicon

Michael Jeske, J.W. Schultze, M. Thönissen et al. · Thin Solid Films · 1995 · 145 citations

Natural Sciences, Materials Engineering, Materials Science +12