Japanese Journal of Applied Physics · 1984 · 129 citations · 0 references
Natural SciencesMaterials EngineeringMaterials ScienceMaterials ProcessingSurface EngineeringSurface ScienceCoatingsPowder ProcessingThin-film DepositionDeposition ProcessesGas FlowSpecific GravitySurface Contamination Removal
Use of a gas jet for the transfer and deposition of metal or ceramic UFP has been studied. Individual particles having a diameter of less than 0.1 µm, are produced by the so-called gas evaporation method. Deposition of the UFP can be made by preparing a colliding gas flow with UFP on a solid surface. Uniformly distributed deposition of different metals or ceramics, regardless of specific gravity, can also be made. A similar technique is also usable with frozen gas UFP (CO 2 for example). A CO 2 UFP blizzard can remove photoresist without contamination or damage to a substrate (thin film chromium coated on glass). The transfer and deposit technique could be a basic method for handling UFP for industrial application.