IEEE Transactions on Plasma Science · 2013 · 21 citations · 7 references
EngineeringElectrical EngineeringMechanical EngineeringElectromagneticsHeat TransferThermal AnalysisHeat Transfer AnalysisHeat Transfer ModelingInterface ModelingThermal Properties Of MaterialsThermal SimulationThermal StressesFriction CoefficientFriction Coefficient Dependence On TemperatureLaunch PerformanceNormal Contact ConditionsTemperature Distribution AnalysisTemperature Distribution ModelingThermal Stresses In Frictional ContactsThermal-mechanical Coupling
The thermal character of the interface between rail and armature significantly affects the launch performance of electromagnetic railguns. In this paper, the friction coefficient μ between brass and aluminum is discussed; it is found that, under hypervelocity and electrical contact conditions, μ maintains an order of magnitude of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-2</sup> or less, which is smaller than that under normal conditions. A 2-D simulation model is developed to analyze the temperature character of armature contact surface caused by friction, and the simulated results concretely demonstrate the order of magnitude of μ when armature is launching in bore. Another 3-D simulation model is also developed to obtain the temperature distribution on the armature contact surface under high current. According to simulation results of interface temperature distribution, the thermal effect on armature wear and contact performance is analyzed. For an electromagnetic railgun with hypervelocity and high current, it is concluded that the heat generated by friction and high current can cause armature surface film to melt and cause armature edges of ends to be damaged. The aluminum film is helpful to improve the contact performance.
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Ian R. McNa, M. Crawford, Sikhanda Satapathy et al. · IEEE Transactions on Plasma Science · 2010 · 45 citations
Engineering, Electrical Engineering, Mechanical Engineering +13
I.R. McNab, Fred C. Beach · IEEE Transactions on Magnetics · 2006 · 43 citations